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Air-cooled Heat Sink
The air-cooled heat sink uses a combination of shovel teeth and heat pipes, combining efficient heat conduction with excellent heat dissipation performance. The shovel tooth process uses precision machining to form dense and regular heat dissipation teeth, greatly increasing the heat dissipation area and improving air convection efficiency; the heat pipe relies on the phase change cycle of the internal working fluid to quickly conduct core heat to the heat dissipation teeth group, achieving efficient heat diffusion. The synergistic effect of the two allows the heat sink to exhibit strong heat dissipation capabilities in a limited space, suitable for scenarios with high requirements for heat dissipation efficiency in inverters used in photovoltaic and wind power generation.
Phase-Change Heat Sink
Phase-change heat sinks utilize the unique physical properties of phase-change materials to achieve highly efficient heat dissipation. Their core function is to absorb a large amount of heat during the material's phase transition from solid to liquid (or liquid to gas). They not only offer excellent temperature control in confined spaces but also boast advantages such as quiet operation and reliability. They are particularly suitable for inverters in photovoltaic and energy storage applications, where demanding requirements for heat dissipation stability and space constraints exist, providing a solid guarantee for the long-term efficient operation of the equipment.
Water Cooling Radiator
Millimeter water-cooled heat sinks not only have the ability to perform topological simulation of complex flow channels, allowing for optimized flow channel design through simulation to ensure efficient coolant circulation; they also master a variety of advanced welding technologies, including vacuum brazing, friction welding, and diffusion bonding. In addition, Millimeter possesses comprehensive testing capabilities, covering thermal resistance testing, flow resistance testing, pressure testing, leak testing, pulse cleaning, ultrasonic C-scanning, and SAT detection, providing stable and reliable water-cooled heat dissipation solutions for inverters in photovoltaic, wind power, and energy storage applications.
TPAK Chip Architecture Baseboard
The Millimeter Automotive Electronic Control TPAK chip substrate, through the deep integration of cold forging flow path integrated molding and cold spray copper technology, builds a dual core advantage of high efficiency heat dissipation and high reliability.
HPC Charging
In the field of high-power charging, Millimeter has been deeply cultivating for many years with forward-looking layout, and has now formed a cold source product matrix covering all scenario needs. From single-gun cold sources and dual-gun cold sources that adapt to different charging scenarios, to active and passive centralized cooling units that meet diverse heat dissipation needs, its full range of products are not only technologically mature, but have also achieved mass supply to leading new energy vehicle companies.
Intelligent Driving Domain Controller
In the field of intelligent driving domain controllers, Millimeter is also actively deploying the research and development of heat dissipation units. Relying on its deep accumulation in the field of heat dissipation technology, it creates suitable heat dissipation solutions for high-computing power and high-power consumption domain controllers. As the "brain" of the vehicle, the intelligent driving domain controller integrates a large number of chips and electronic components, generating intensive heat during operation, and requiring extremely high efficiency and stability of heat dissipation. In response to this characteristic, Millimeter, with its active thinking in the "two advanced" (advanced thermal management + advanced materials) strategy, builds a solid heat dissipation defense line for the reliable operation of the intelligent driving system.
SVG
In the power grid SVG field, Millimeter has engaged in years of in-depth cooperation with leading enterprises. Based on stable technological output and product quality, a solid foundation of cooperation has been built. To meet the high reliability and mass production needs of power grid SVG equipment for heat dissipation components, Millimeter has built an advanced automated production line. Through precise process control and efficient production scheduling, it ensures that every product meets stringent technical standards.
Flexible DC Transmission and Distribution
In the flexible DC transmission and distribution field, Milli has been deeply engaged for many years. With its profound technical accumulation and engineering experience, Milli has been deeply involved in numerous domestic and international ultra-high voltage projects. Addressing the core heat dissipation challenge of crimped power devices in this field, Milli has devoted itself to R&D, forming a highly efficient heat dissipation solution suitable for ultra-high voltage scenarios. These technological achievements not only provide key support for the stable operation of flexible DC transmission and distribution systems, but also help "national treasures" play an important role in the construction of the energy internet.
In the fields of supercomputing and artificial intelligence, with the continuous increase in computing density, the heat dissipation pressure of chips and equipment is becoming increasingly significant, putting extremely high demands on the efficiency and stability of thermal solutions. Millimeter is also actively involved in this field, relying on its deep accumulation in thermal technology to develop targeted thermal solutions adapted to scenarios such as supercomputing clusters and AI servers.
As a core component in chip performance verification, semiconductor test equipment generates concentrated heat from its internal precision components under high-frequency, high-load operation. The testing environment also demands strict temperature stability and spatial adaptability, making heat dissipation a critical factor affecting testing accuracy and equipment lifespan. Millimeter-level precision has prioritized heat dissipation solutions in this field, leveraging its accumulated expertise in complex heat dissipation scenarios to develop highly efficient heat dissipation solutions tailored to the miniaturization and high-density characteristics of semiconductor test equipment.
